Laser Engraving & Ablation
Do you need particularly deep markings?
Find the perfect laser solution for your application.
Home Laser Engraving
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Laser Engraving & Ablation
The process of laser engraving describes the removal of a material so that a depression is created in the irradiated area. This can be used to create markings, but also to generate specific surface structures within these engraved areas.
The process of laser engraving or ablation can be carried out on many different types of material.
Depending on the material, short-pulse or ultrashort-pulse laser beam sources are used.
Laser engraving of metal
With our state-of-the-art short-pulse and ultrashort-pulse laser beam sources, you can engrave all metals precisely and efficiently. Our technology impresses with its outstanding beam quality and extremely short pulse durations, which is particularly advantageous when processing non-ferrous and precious metals.
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Laser engraving of ceramics
Almost all ceramics can be precisely engraved with our lasers. The good beam quality and ultra-short pulses of our ps lasers enable stress-free processing with minimal heat input.
Laser engraving of plastic
Especially with thermosetting plastics, engraving is possible by removing material with a laser. Good legibility is achieved by the difference in reflection of the engraving.
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Removal of plastic
With coated plastic parts, excellent contrast is achieved by removing the top layer. Material combinations whose upper layer interacts more strongly with the laser light than the carrier material, as is the case with laser foils, for example, are particularly suitable.
Removal of plastic
Plastic-based corrosion protection coatings applied to metallic substrates can be removed with a high-power laser. High removal rates can be achieved thanks to high removal rates and a homogeneous beam profile. The metal substrate is not damaged and is available for further processing (e.g. bonding or electroplating)
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Individual customer solutions
Our experienced development department is happy to work in partnership with you to develop your specific solutions in the fields of optics, mechanics, electronics and software.