Micromachining
Laser processes for the smallest dimensions
Discover the potentials for micromachining using laser beam technology.
Micromachining
A large number of industrial applications make use of micromachining with lasers. Compared to conventional methods, lasers enable faster process cycles with higher precision and lower costs. Both our short-pulse and ultrashort-pulse lasers are suitable for such applications.
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Micromachining refers to the processing of materials on a very small scale. These methods can be used for processes such as high-precision drilling, cutting, structuring or micro-marking of a wide variety of materials. PHOTON ENERGY's laser systems are used, for example, for UDI-compliant, autoclavable marking on stainless steel materials or so-called lab-on-a-chip components.
Laser Drilling
Creating holes on a microscopic scale is playing an increasingly important role in many industries. For example, metal, polymers and glass are processed in this way.
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Microscopic holes can also be drilled in ceramics in a similar way. By processing with our CEPHEUS picosecond laser, you can achieve material ablation without melting. This produces smooth cut edges without fractures and an ablation result without microcracks or material damage.
Micro laser marking
The low heat input of our CEPHEUS picosecond laser makes it possible, for example, to create very small markings on glass with a font size of just 40 µm.
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Due to this low heat impact, ultrashort pulse lasers are particularly suitable for micro-material processing of a wide range of materials.
The ultrashort laser pulses with very high pulse powers generate such high energy densities that the material is almost directly transferred to the vaporization state. This is also known as "cold processing" or "cold ablation". This makes it possible to produce the finest structures and material removal in the micrometer range.
Structuring
The CEPHEUS picosecond laser is suitable for microstructuring on glass. The processing of surfaces is possible on the smallest scales. This allows structures to be created that are required for complex end products.
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The decisive factor for the quality of this structuring is the production with an ultrashort pulse laser, which can be implemented without thermal effect in the material.
One field of application for such microstructures is microfluidics, for example. The lab-on-a-chip devices used there can be used for various processes, including the transportation, separation or mixing of liquids. Such microstructures are also suitable as reaction vessels. The structures required in microfluidics typically consist of channels and sources and have diameters in the 100 micrometer range.
Laser cutting
Cutting glass with a laser has many advantages over conventional mechanical cutting methods. Laser glass cutting is non-contact, virtually residue-free and weld-free.
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Ultra-short pulse laser beam sources are particularly suitable for cutting glass. The very high peak pulse power of USP lasers enables glass to be ablated without any problems and at the same time a very high cutting quality can be achieved without damaging the material in the cutting zone.
In many cases, laser-cut parts no longer require post-processing, which means that process costs for downstream production steps can be saved.
Individual customer solutions
Our experienced development department is happy to work in partnership with you to develop your specific solutions in the fields of optics, mechanics, electronics and software.